Our Core Expertise What We Do
We deliver comprehensive, end-to-end ASIC design solutions across the full semiconductor lifecycle. Our expertise spans architecture, analog and digital design, verification, physical implementation, and signoff—enabling high-performance, scalable, and reliable silicon.
Architecture & IP Design
At spintronicsAI with extensive research we will build data models wrt to your product requirements and schedule constraints.
These Data models help in exploring trade offs between business, financial and technical constraints for achieving right TTM
Detailed algorithms will be built for tracking every stage of implementation and signoff
With multiple handoffs our custom flows will ensure the quality of the design is maintained throughout the design cycle
Custom built signoff flows will ensure quality checklist from customer is met and ensure design is ready for next stage of implementation.
Standard Cell
High Density, High Speed, Low power
Design, Layout and Characterization
Analog and Mixed Signal
ADC, DAC, Regulator, PLL, DLL, Transmitter (TX), Receiver (RX)
High-Speed Serdes, DDR, other PHY Interfaces, USB, Die-to-Die etc
Post Layout Extraction (PEX) Simulation and Verification
Physical Verifications (ANT, DRC, DFM, LVS, ERC, PAD, PERC, ESD/Latch-up, EMIR/SHE etc)
Memory, IO PAD Library Design & Simulation, AMS Verification
Block level, IP level and Chip level Layout
Circuit and Layout Design
RTL Design and Integration
-
Design Implementation
-
Translating power spec to UPF
-
Design and UPF validation
-
LINT and CDC checks
-
RTL Handoff
Verification
-
Verification Service for ASIC, SOC and FPGA Design
-
VMM, OVM, UVM, RVM, eRM methodology based verification
-
Intellectual Property Verification
-
Verification Assessment
-
Verification Planning
-
Verification Environment Development using bus functional models, monitors, checkers, test pattern/packet generator and score boards
-
Functional verification
Digital Frontend Design
Floorplanning & Partitioning – Efficient block partitioning, area budgeting, and hierarchical planning
Power Planning & Power Grid (PG) – Robust power grid design, IR/EM-aware implementation
Low Power Implementation – UPF/CPF-based design, power gating, multi-voltage domains
Placement & Optimization – Timing-driven placement and congestion optimization
Clocking (CTS) – Clock tree synthesis, skew/jitter optimization, clock distribution
Routing (Global & Detailed) – Signal integrity-aware routing with DRC clean closure
STA (Static Timing Analysis) – Setup/hold closure, multi-corner multi-mode (MCMM) analysis
Block & Chip-Level Implementation – End-to-end execution from block to full-chip level
Physical Verification (PV) – DRC, LVS, ERC, antenna checks, and signoff compliance
Signoff & Tapeout Readiness – Ensuring design meets foundry and product-level requirements
Digital Backend Design
Scan Insertion & Compression – Efficient scan chains with reduced test data
Boundary Scan (1149.x) – Enables board-level and interconnect testing
MBIST / LBIST – Built-in self-test for memories and logic blocks
Test Point Insertion – Improves fault coverage and observability
OCC & Clocking – Supports at-speed testing with controlled clocks
ATPG & Pattern Validation – Test pattern generation, simulation, and debug
Fault Coverage & GLS – Ensures high defect detection and design correctness
DFT Signoff & Bring-up – Tapeout readiness and silicon validation support
DFT
Signoff
Timing closure using MCMM methodologies, AI based support for faster TTM
LP static signoff for RTL/logical-netlist/Physical-Netlist using CLP/VCLP
RTL-Netlist and Netlist-Netlist Equivalency Signoff using Iec/Formal
Dynamic-power signoff for power-corner
Have an Idea in mind? Let’s Talk