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Our Core Expertise What We Do

We deliver comprehensive, end-to-end ASIC design solutions across the full semiconductor lifecycle. Our expertise spans architecture, analog and digital design, verification, physical implementation, and signoff—enabling high-performance, scalable, and reliable silicon.

Architecture & IP Design

  • At spintronicsAI with extensive research we will build data models wrt to your product requirements and schedule constraints.

  • These Data models help in exploring trade offs between business, financial and technical constraints for achieving right TTM

  • Detailed algorithms will be built for tracking every stage of implementation and signoff

  • With multiple handoffs our custom flows will ensure the quality of the design is maintained throughout the design cycle

  • Custom built signoff flows will ensure quality checklist from customer is met and ensure design is ready for next stage of implementation.

chip design

RTL Design and Integration

  • Design Implementation

  • Translating power spec to UPF

  • Design and UPF validation

  • LINT and CDC checks

  • RTL Handoff

Verification

  • Verification Service for ASIC, SOC and FPGA Design

  • VMM, OVM, UVM, RVM, eRM methodology based verification

  • Intellectual Property Verification

  • Verification Assessment

  • Verification Planning

  • Verification Environment Development using bus functional models, monitors, checkers, test pattern/packet generator and score boards

  • Functional verification

Digital Frontend Design

digital frontend
circuit chip

  • Block-Level, IP-Level, and Full-Chip Custom Layout Design

  • Memory Compiler Development and Custom Memory Design

  • SRAM, Register File (RF), ROM, OTP, and Embedded Memory Layout

  • High-Density Memory Array Architecture and Optimization

  • Memory Characterization, Verification, and Reliability Analysis

  • Analog, Mixed-Signal, and Memory Layout Integration

  • Advanced Node Layout Implementation and Signoff Support

Circuit and Layout Design (Custom IP, Memory & Layout Development)

digital backend design

  • Floorplanning & Partitioning – Efficient block partitioning, area budgeting, and hierarchical planning

  • Power Planning & Power Grid (PG) – Robust power grid design, IR/EM-aware implementation

  • Low Power Implementation – UPF/CPF-based design, power gating, multi-voltage domains

  • Placement & Optimization – Timing-driven placement and congestion optimization

  • Clocking (CTS) – Clock tree synthesis, skew/jitter optimization, clock distribution

  • Routing (Global & Detailed) – Signal integrity-aware routing with DRC clean closure

  • STA (Static Timing Analysis) – Setup/hold closure, multi-corner multi-mode (MCMM) analysis

  • Block & Chip-Level Implementation – End-to-end execution from block to full-chip level

  • Physical Verification (PV) – DRC, LVS, ERC, antenna checks, and signoff compliance

  • Signoff & Tapeout Readiness – Ensuring design meets foundry and product-level requirements

Digital Backend Design

  • Scan Insertion & Compression – Efficient scan chains with reduced test data

  • Boundary Scan (1149.x) – Enables board-level and interconnect testing

  • MBIST / LBIST – Built-in self-test for memories and logic blocks

  • Test Point Insertion – Improves fault coverage and observability

  • OCC & Clocking – Supports at-speed testing with controlled clocks

  • ATPG & Pattern Validation – Test pattern generation, simulation, and debug

  • Fault Coverage & GLS – Ensures high defect detection and design correctness

  • DFT Signoff & Bring-up – Tapeout readiness and silicon validation support

DFT

dft chip
signoff

Signoff

  • Timing closure using MCMM methodologies, AI based support for faster TTM

  • LP static signoff for RTL/logical-netlist/Physical-Netlist using CLP/VCLP

  • RTL-Netlist and Netlist-Netlist Equivalency Signoff using Iec/Formal

  • Dynamic-power signoff for power-corner

spintronics ai

Have an Idea in mind? Let’s Talk

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